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13715263164
13715263164
| 项目 | 批量 | 样品 | |
| 层数 | 2~68L |
120L |
|
| 最大板厚 | 10mm（394mil） |
14mm（551mil） |
|
最小线宽间距 |
内层 | 2.2mil/2.2mil |
2.0mil/2.0mil |
| 外层 | 2.5/2.5mil |
2.2/2.2mil |
|
| 对位能力 | 同张芯板对位 |
±25um |
±20um |
层间对位 |
±5mil |
±4mil |
|
最大铜厚 |
6Oz |
30Oz |
|
孔径 |
机械钻孔 |
≥0.15mm(6mil) |
≥0.1mm(4mil) |
| 激光钻孔 | 0.1mm（4mil） |
0.050mm（2mil） |
|
最大尺寸 （完成尺寸） |
单板 |
850mmX570mm |
1000mmX600mm |
背板 |
1250mmX570mm |
1320mmX600mm |
|
厚径比 （完成孔径） |
单板 |
20:1 |
28:1 |
| 背板 | 25:1 |
35:1 |
|
材料 |
无铅/无卤 |
EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF |
|
高速 |
Megtron6, Megtron4,Megtron7,TU872SLK,FR408HR,N4000-13 Series,MW4000,MW2000,TU933 |
||
| 高频 | Ro3003, Ro3006, Ro4350B,Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 |
||
| 其他 | Polyimide, Tk, LCP, BT, C-ply,Fradflex, Omega , ZBC2000, |
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| 表面处理 | 喷锡，化学镍金，化学锡，OSP，化学银，金手指，电镀硬金/软金，选择性OSP，化学镍钯金 |
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| 产品类型 | 参数 | 2017 | 2018 | 2019 | ||||
| 批量 | 样品 | 批量 | 样品 | 批量 | 样品 |
|||
| 背板 | 层数 | 68L | 100L | 68L | 100L | 68L | 120L | |
| 完成尺寸 | 1250mmX570mm |
1320mmX570mm |
1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | ||
| 厚度 | 10mm |
14mm | 10mm | 14mm | 10mm | 14mm | ||
厚径比(完成孔径) |
22:1 | 25:1 | 25:1 | 35:1 | 25:1 | 35:1 | ||
| 单板 | 层数 | 36 | 32 | 36 | 36 | 36 | 36 | |
| 外层线宽/间距 | 3mil/3mil |
2.8mil/2.8mil |
3mil/3mil |
2.5mil/2.5mil | 3mil/3mil |
2.5mil/2.5mil | ||
| 内层线宽/间距 | 2.2mil/2.2mil |
2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | ||
| 厚径比(完成孔径) | 18:1 |
24:1 | 20:1 | 28:1 | 20:1 | 28:1 | ||
| 阻抗公差 | ±8% |
±5% | ±7% | ±5% | ±7% | ±5% | ||
| 厚铜 | 最大铜厚 | 6Oz |
30Oz | 6Oz | 30Oz | 6Oz | 30Oz | |
| HDI | 结构 | Any Layer(10L) |
Any Layer(12L) | Any Layer(10L) | Any Layer(14L) | Any Layer(10L) | Any Layer(16L) | |
| 外层线宽/间距 | 2.5/2.5mil |
2.2/2.2mil | 2.2/2.2mil | 2.0/2.0mil | 2.0/2.0mil | 1.6/1.6mil | ||
| 盲孔厚径比 | 1:1 |
1.2:1 | 1:1 | 1.2:1 | 1.2:1 | 1.2:1 | ||
| 射频产品 | 微带线精度 | 线宽 | ±0.8mil |
±0.8mil | ±0.8mil | ±0.5mil | ±0.8mil | ±0.5mil |
| 线长 | ±1.5mil |
±1.5mil | ±1.5mil | ±1.2mil | ±1.2mil | ±1mil | ||
| 金属基 | 结构 | Post-bonding, Pre-bonding,Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U) |
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| 刚挠产品 | 结构 | Book, Air-gap, Fly-tail,Unsymmetrical, Semi-flex |
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| 材料 | Polyimide, Halogen-free, Lead-free,LCP, Tk |
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| 特殊工艺 | POFV(VIPPO)，混压，局部混压，长短/分级/分段金手指，空腔，台阶槽，背钻，侧壁金属化，N+N结构，双面压接机械盲孔，埋入式芯片/分立器件/平面电容电阻，局部厚铜，高温压合，铜浆/银浆塞孔，跳孔 |
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